Near-memory compute module

ABSTRACT

Disclosed herein are systems having an integrated circuit device disposed within an integrated circuit package having a periphery, and within this periphery a transaction processor is configured to receive a combination of signals (e.g., using a standard memory interface), and intercept some of the signals to initiate a data transformation, and forward the other signals to one or more memory controllers within the periphery to execute standard memory access operations (e.g., with a set of DRAM devices). The DRAM devices may or may not be in within the package periphery. In some embodiments, the transaction processor can include a data plane and control plane to decode and route the combination of signals. In other embodiments, off-load engines and processor cores within the periphery can support execution and acceleration of the data transformations.

RELATED APPLICATIONS

This application is a continuation application of U.S. patent application Ser. No. 14/536,312, filed Nov. 7, 2014, which claims the benefit of priority U.S. Patent Application No. 61/924,608, filed Jan. 7, 2014; and U.S. Patent Application No. 61/925,623, filed Jan. 9, 2014, the entire contents of all are hereby incorporated by reference.

FIELD

This disclosure relates to the field of memory systems and more particularly to techniques for near-memory compute modules.

BACKGROUND

Many computing systems (e.g., servers, workstations, desktops, laptops, etc.) use memory or memory modules that can be inserted or plugged into a socket on a printed circuit board (e.g., motherboard or blade) of the computing system. The memory stores data accessible by a host controller and other components in the computing system, and a processor performs operations over the stored data. A common form of pluggable memory is the Dual In-line Memory Module (DIMM). DIMMs can contain multiple memory chips (e.g., Dynamic Random Access Memory or DRAM chips), each of which has a particular data bus width (e.g., 4 bits or 8 bits). For example, a DIMM may have eight 8-bit DRAM chips, or sixteen 4-bit DRAM chips, arranged in parallel to provide a total 64-bit wide data bus. Each arrangement of 64 data bits from parallel DRAM chips is called a rank. The memory arrays are further subdivided into addressable groups, rows, and columns. A data bus (e.g., DQ bus) is connected to the host controller to allow writing and reading of datasets to and from the DIMM. A command/address bus (e.g., CA bus) also runs between the host controller and each DIMM. The CA bus and DQ bus together form a system bus. The system bus and communication protocol between the host controller and DRAM chips is often standardized (e.g., following “the JEDEC DDR4 SDRAM standard”, etc.) to ensure product interoperability and reduce costs for all the stakeholders in the computing business ecosystem.

As computing systems increase in performance, the amount of memory and complexity of the host boards (e.g., motherboards) also increases. This introduces several issues for legacy memory systems and architectures. For example, with an un-buffered DIMM (e.g., UDIMM), the CA bus is connected directly to every DRAM chip on the DIMM. As a result, there is a high electrical load (e.g., capacitive load) on the CA bus that is proportional to the product of the number of DRAM chips and the number of ranks. For the DQ bus, the electrical load is proportional to the number of ranks. Some legacy memory systems have employed buffering devices on or near the DRAM chips to boost the drive of the DQ and CA signals in the presence of high electrical loads. Even with such load reduction DIMMs (e.g., LRDIMMs), however, legacy memory systems have further limitations in capability and performance.

One such limitation is related to dataset access temporal and spatial locality. Temporal locality is a time-wise measure. One such measure depends from the time locality of two events. For example, how soon after a word of data (or other portion of a dataset) that word is accessed or expected to be accessed again. Spatial locality is a measure of how soon after a dataset at a given address location is accessed that another dataset at a relatively close address location is expected to be accessed.

In computing applications with low spatial and temporal locality (e.g., random querying or key-value indexing of large datasets), ongoing dataset accesses primarily move data into and out of the DIMMs (e.g., to facilitate data transformation operations performed in a processing element). In such applications (e.g., that exhibit low temporal and spatial locality), legacy memory systems expend more power in the process of data movement than in the data transformation operations. Moreover, legacy memory systems place high demands on the host controller during these data movement operations.

Techniques are needed to address the problem of implementing a memory system that exhibits improved power consumption as well as increased performance in such computing applications—yet without requiring a memory system or memory architecture re-design. None of the aforementioned legacy approaches achieve the capabilities of the herein-disclosed techniques. Therefore, there is a need for improvements.

SUMMARY

The present disclosure provides improved environments, methods, and systems suited to address the aforementioned issues with legacy approaches. More specifically, the present disclosure provides a detailed description of techniques used in memory systems including near-memory compute modules. The claimed embodiments address the problem of limited memory system scalability and performance (e.g., in computing applications with low temporal and spatial locality). More specifically, some claims are directed to approaches for implementing a memory system that exhibits high electrical load drive capability and increased performance (e.g., power and speed) in computing applications with low temporal and spatial locality, while maintaining product interoperability, which advances the technical fields for addressing the problem of limited memory system scalability and performance, as well as advancing peripheral technical fields.

Embodiments include an integrated circuit device disposed within an integrated circuit package having a periphery, and within this periphery a transaction processor is configured to receive a combination of signals (e.g., using a standard memory interface), and intercept some of the signals to initiate a data transformation, and forward the other signals to one or more memory controllers within the periphery to execute standard memory access operations (e.g., with a set of DRAM devices). The DRAM devices may or may not be in within the package periphery. In some embodiments, the transaction processor can include a data plane and control plane to decode and route the combination of signals. In other embodiments, off-load engines and processor cores within the periphery can support execution and acceleration of the data transformations.

Further details of aspects, objectives, and advantages of the disclosure are described below and in the detailed description, drawings, and claims. Both the foregoing general description of the background and the following detailed description are exemplary and explanatory, and are not intended to be limiting as to the scope of the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings, described below, are for illustration purposes only. The drawings are not intended to limit the scope of the present disclosure.

FIG. 1A is an environment showing a memory system for comparing to memory systems having a near-memory compute module.

FIG. 1B is an environment showing a memory system including a near-memory compute module, according to one embodiment.

FIG. 2A is a diagram showing communications between a host controller and a DIMM for comparing to memory systems having a near-memory compute module, according to some embodiments.

FIG. 2B is a diagram showing communications among a host controller, a near-memory compute module, and a DIMM, as used in memory systems having a near-memory compute module, according to some embodiments.

FIG. 2C is a diagram showing additional example communications among a host controller, a near-memory compute module, and a DIMM, as used in memory systems having a near-memory compute module, according to some embodiments.

FIG. 2D is a diagram showing additional example communications among a host controller, a near-memory compute module, and a DIMM, as used in memory systems having a near-memory compute module, according to some embodiments.

FIG. 3 presents annotated timing diagrams for memory systems having a near-memory compute module in comparison to memory systems not having a near-memory compute module, according to some embodiments.

FIG. 4A is a diagram depicting varying spatial and temporal locality present in memory systems having near-memory compute module.

FIG. 4B is a diagram showing performance improvements when using a near-memory compute module, according to some embodiments.

FIG. 5 depicts an environment showing components of a near-memory compute module, according to one embodiment.

FIG. 6 depicts an environment including a transactional memory controller implemented as a near-memory compute module, according to one embodiment.

FIG. 7 depicts a diagram showing communications between a host controller and a transactional memory controller implemented as a near-memory compute module, according to one embodiment.

FIG. 8 is a block diagram of a switch module used in a transactional memory controller implemented as a near-memory compute module, according to one embodiment.

FIG. 9 is a functional layer diagram of a deserializer module used in a transactional memory controller implemented as a near-memory compute module, according to one embodiment.

FIG. 10 is a functional layer diagram of a serializer module used in a transactional memory controller implemented as a near-memory compute module, according to one embodiment.

FIG. 11 is a block diagram of a DRAM memory controller used in a transactional memory controller implemented as a near-memory compute module, according to one embodiment.

DETAILED DESCRIPTION Overview

Techniques are needed to address the problem of implementing a memory system that exhibits low power consumption and increased performance (e.g., improvements in power and speed) in computing applications with low temporal and spatial locality. More particularly, disclosed herein and in the accompanying figures are exemplary environments, methods, and systems for near-memory compute modules.

The disclosed techniques for near-memory compute modules provide memory interface signal buffering for memory system scalability, and also supports close proximity data transformation functions. Performing data transformation functions in close proximity to the memory devices is merely one aspect of the herein-disclosed system performance improvements. In some embodiments, the data transformations are provided by a module on the same device (e.g., SoC, multi-chip package, etc.) as the memory devices. The disclosed near-memory compute modules can also be configured to communicate with the host controller through standard memory interfaces (e.g., JEDEC DDR4 DRAM standard) or other standard interfaces (e.g., SerDes).

The problems attendant to very large memories is not limited to the need for performing data transformation functions in close proximity to the memory devices. Indeed, as computing systems increase in performance, the amount of memory and complexity of the host boards (e.g., motherboards) also increases. This introduces several issues for legacy memory systems and architectures. For example, with an un-buffered DIMM (e.g., UDIMM), certain busses are connected directly to every DRAM chip on the DIMM. As a result, there is a high electrical load (e.g., capacitive load) on such busses (e.g., a CA bus) that is proportional to the product of the number of DRAM chips and the number of ranks. For other busses such as the DQ bus, the electrical load is proportional to the number of ranks. Some legacy memory systems have employed buffering devices on or near the DRAM chips to boost the drive of the DQ and CA signals in the presence of high electrical loads. Yet, even with such load reduction DIMMs (e.g., LRDIMMs), very large memory footprints using legacy memory systems have further limitations in capability and performance, at least in that such large memory systems demand data transformation functions to be performed in close proximity to the memory devices themselves.

Definitions

Some of the terms used in this description are defined below for easy reference. The presented terms and their respective definitions are not rigidly restricted to these definitions—a term may be further defined by the term's use within this disclosure.

-   -   The term “exemplary” is used herein to mean serving as an         example, instance, or illustration. Any aspect or design         described herein as “exemplary” is not necessarily to be         construed as preferred or advantageous over other aspects or         designs. Rather, use of the word exemplary is intended to         present concepts in a concrete fashion.     -   As used in this application and the appended claims, the term         “or” is intended to mean an inclusive “or” rather than an         exclusive “or”. That is, unless specified otherwise, or is clear         from the context, “X employs A or B” is intended to mean any of         the natural inclusive permutations. That is, if X employs A, X         employs B, or X employs both A and B, then “X employs A or B” is         satisfied under any of the foregoing instances.     -   The articles “a” and “an” as used in this application and the         appended claims should generally be construed to mean “one or         more” unless specified otherwise or is clear from the context to         be directed to a singular form.     -   The term “logic” means any combination of software or hardware         that is used to implement all or part of the disclosure.     -   The term “non-transitory computer readable medium” refers to any         medium that participates in providing instructions to a logic         processor.     -   A “module” includes any mix of any portions of computer memory         and any extent of circuitry including circuitry embodied as a         processor.

Reference is now made in detail to certain embodiments. The disclosed embodiments are not intended to be limiting of the claims.

DESCRIPTIONS OF EXEMPLARY EMBODIMENTS

FIG. 1A is an environment 1A00 showing a memory system for comparing to systems having a near-memory compute module. As shown in FIG. 1A, environment 1A00 comprises a host controller 102, a first DIMM 108 ₁, and a second DIMM 108 ₂. Host controller 102 further comprises a CPU core 103, a cache memory 104, and a memory controller 105. Host controller 102 can also comprise multiple instances each of CPU core 103, cache memory 104, and memory controller 105. Host controller 102 of environment 1A00 can further be based on various architectures (e.g., Intel x86, ARM, MIPS, IBM Power, etc.). Cache memory 104 can be dedicated to CPU core 103 or shared with other cores. First DIMM 108 ₁ comprises, in part, a first set of memory chips 109 ₁ (e.g., eight DDR4 SDRAM chips). Second DIMM 108 ₂ also comprises, in part, a second set of memory chips 109 ₂. Host controller 102 communicates with DIMMs 108 ₁ and 108 ₂ through a system bus 110 in order to write and read datasets to and from memory chips 109 ₁ and 109 ₂ on DIMMs 108 ₁ and 108 ₂, respectively. Host controller 102 is coupled to DIMMs 108 ₁ and 108 ₂ through system bus 110 using a standard physical interface 111 (e.g., compliant with the JEDEC DDR4 SDRAM standard, Serial ATA SerDes standard, etc.).

FIG. 1B is an environment 1B00 showing a memory system including a near-memory compute module. As an option, one or more instances of environment 1B00 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, environment 1B00 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 1B, environment 1B00 comprises all of the components and infrastructure shown in environment 1A00, plus a first near-memory compute module 120 ₁, and a second near-memory compute module 120 ₂. Modules 120 ₁ and 120 ₂ are sometimes termed “near-memory” due to their close physical and electrical proximity to memory chips 109 ₁ and 109 ₂, respectively. In environment 1B00, near-memory compute modules 120 ₁ and 120 ₂ are on the same printed circuit board or substrate as DIMMs 108 ₁ and 108 ₂ to form a first compute DIMM (CDIMM) 122 ₁ and a second compute DIMM (CDIMM) 122 ₂, respectively. In some embodiments, the near-memory compute module can comprise one device (e.g., system-on-chip or SoC), multiple devices in a single package or printed circuit board, multiple separate devices, can be integrated into the memory chips, and can have other variations, modifications, and alternatives.

Host controller 102 is coupled to CDIMMs 122 ₁ and 122 ₂ through system bus 110 and standard physical interface 111 as in environment 1A00. Host controller 102 can also continue to write and read datasets to and from memory chips 109 ₁ and 109 ₂. Near-memory compute modules 120 ₁ and 120 ₂ in environment 1B00 can offer additional capabilities beyond that of the system in environment 1A00. For example, modules 120 ₁ and 120 ₂ can provide buffering to boost the drive of the DQ and CA signals on system bus 110. Also, modules 120 ₁ and 120 ₂ can initiate data transformation operations for datasets stored in memory chips 109 ₁ and 109 ₂ based on data sent from host controller 102 (e.g., commands, operands, etc.). Further, modules 120 ₁ and 120 ₂ can accelerate data transformation operations (e.g., compress operations, uncompress operations, encryption operations, decryption operations, Galois field arithmetic operations, hashing and/or indexing operations, etc.) through parallel background processing that is performed within the boundaries of CDIMMs 122 ₁ and 122 ₂.

The shown CDIMMs 122 ₁ and 122 ₂ use a standard physical interface 111 to communicate with host controller 102. Architectural changes to CPU core 103, memory controller 105, system bus 110, and other components are not required. Use of such an interface to CDIMM 122 ₁ and CDIMM 122 ₂ supports product interoperability and, in some embodiments, this arrangement serves to conserve board area. Further, with data transformation operations or computing in close proximity to memory chips 109 ₁ and 109 ₂, less power will be expended in data movement. Additional background computing capability within CDIMM 122 ₁ and CDIMM 122 ₂ will also allow some tasks to be offloaded from host controller 102 so it can attend to other compute bound operations. By taking advantage of the parallel processing opportunities of the near-memory computing architecture, many computing system performance speed-ups are achievable. Systems with near-memory compute capability can be very beneficial for both structured applications (e.g., in-memory database management) and non-structured applications (e.g., “big data”), as well as in other applications.

FIG. 2A is a diagram 2A00 showing communications between a host controller and a DIMM for comparing to memory systems having a near-memory compute module. As an option, one or more instances of diagram 2A00 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, diagram 2A00 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 2A, diagram 2A00 presents example operations and communications on and among host controller 102 and DIMM 108 ₁. Specifically, diagram 2A00 depicts a memory write operation followed by a memory read operation. More specifically, host controller 102 and DIMM 108 ₁ can be designed and configured to enable host controller 102 to schedule memory commands 202 ₁ (e.g., by memory controller 105 based on instructions from CPU core 103) while memory chips 109 ₁ of DIMM 108 ₁ are waiting in an idle state 232 ₁. In this example and for the embodiment depicted in diagram 2A00, memory chips 109 ₁ of DIMM 108 ₁ are all waiting in idle state 232 ₁. In other examples and embodiments the DIMMs can be in various other states (e.g., refreshing, active power down, pre-charge power down, reading, writing, etc.). Host controller 102 can then issue a bank activate command (ACT) 203 ₁ to DIMM 108 ₁. Bank activate command 203 ₁ will open or activate a row in a particular bank of a particular rank of DIMM 108 ₁ for subsequent access. Bank activate command 203 ₁ is executed, in part, by host controller 102 providing a certain combination of signals (e.g., chip select, bankgroup select, bank select, row address, etc.) on system bus 110. Upon receiving bank activate command 203 ₁, DIMM 108 ₁ will select the bank and row 233 ₁ specified in bank activate command 203 ₁. After a wait time 204 ₁, host controller 102 can issue a write command (WR) 205 ₁ to DIMM 108 ₁. Write command 205 ₁ is executed, in part, by host controller 102 providing a certain combination of signals (e.g., column address, etc.) on system bus 110. Upon receiving write command 205 ₁, DIMM 108 ₁ will select the column 234 ₁ of the activated bank and row. After a wait time 206 ₁, host controller 102 will provide write data (Din) 207 ₁ on system bus 110. DIMM 108 ₁ will then sense dataset Din on system bus 110 and write data 235 ₁ to the selected memory address to complete the memory write operation.

After a wait time 208 ₁, host controller 102 can issue a read command (RD) 209 ₁ to DIMM 108 ₁. Read command 209 ₁ is executed, in part, by host controller 102 providing a certain combination of signals (e.g., column address, etc.) on system bus 110. In this example, the memory read operation is targeting the same rank, bank, and row activated with bank activate command 203 ₁ and no additional precharging or activating commands are required. Upon receiving read command 209 ₁, DIMM 108 ₁ will select the column 234 ₂ of the activated bank and row. After a wait time 210 ₁, DIMM 108 ₁ will provide read data (Dout) 235 ₁ on system bus 110. Host controller 102 will then sense dataset Dout on system bus 110 and read data 211 ₁ to complete the memory read operation.

In some embodiments and environments, wait times 204 ₁, 206 ₁, 208 ₁, and 210 ₁ can be of varying but known duration to, in part, accommodate for the inherent electrical response time or latency associated with accessing datasets on memory chips 109 ₁. When the durations of wait times 204 ₁, 206 ₁, 208 ₁, and 210 ₁ are known, memory controller 105 of host controller 102 can schedule commands 202 ₁ that account for the required delays between commands and operations. For a JEDEC DDR4 SDRAM standard physical interface 111, for example, wait time 206 ₁ (e.g., write latency or WL) is specified as 9 clock cycles when operating at 1600 MT/s with no additive latency (AL). For the same JEDEC DDR4 SDRAM standard physical interface 111, wait time 210 ₁ (e.g., read latency or RL) is specified as 11 clock cycles when operating at 1600 MT/s with no additive latency.

FIG. 2B is a diagram 2B00 showing communications among a host controller, a near-memory compute module, and a DIMM, as used in memory systems having a near-memory compute module. As an option, one or more instances of diagram 2B00 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, diagram 2B00 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 2B, diagram 2B00 presents example operations and communications on and among host controller 102, near-memory compute module 120 ₁, and DIMM 108 ₁ from diagram 1B00 of FIG. 1B in some embodiments. Specifically, diagram 2B00 depicts a transaction or data transformation operation utilizing a single operand that is initiated and executed by near-memory compute module 120 ₁. Diagram 2B00 further depicts a memory write operation and memory read operation (e.g., such as that depicted and described in diagram 2A00 of FIG. 2A) when near-memory compute module 120 ₁ is present. More specifically, host controller 102 and DIMM 108 ₁ can be designed and configured to enable host controller 102 to schedule memory commands 202 ₂ (e.g., by memory controller 105 based on instructions from CPU core 103) while memory chips 109 ₁ of DIMM 108 ₁ are waiting in an idle state 232 ₂. For this example and embodiment depicted in diagram 2B00, memory chips 109 ₁ of DIMM 108 ₁ are all waiting in idle state 232 ₂, but can also be in various other states (e.g., refreshing, active power down, pre-charge power down, reading, writing, etc.) in other examples and embodiments. Host controller 102 can then issue a bank activate command (ACT) 203 ₂ to near-memory compute module 120 ₁. The combination of signals (e.g., chip select, bankgroup select, bank select, row address, etc.) provided by host controller 102 on system bus 110 during bank activate 203 ₂ will, in part, cause near-memory compute module 120 ₁ to either forward ACT command 212 ₁ from host controller 102 directly to DIMM 108 ₁, or initialize module 213 ₁ for subsequent activity (e.g., receiving instructions and data for transactions or operations). If DIMM 108 ₁ receives the forwarded bank activate command 203 ₂ (e.g., from forward ACT 212 ₁), DIMM 108 ₁ will select the bank and row 2332 specified in bank activate command 203 ₂. After a wait time 204 ₂, host controller 102 can issue a write command (WR) 205 ₂ to near-memory compute module 120 ₁. The combination of signals (e.g., column address, etc.) provided by host controller 102 on system bus 110 during write command 205 ₂ will, in part, cause near-memory compute module 120 ₁ to either forward WR command 214 ₁ from host controller 102 directly to DIMM 108 ₁, or intercept and decode command 215 ₁. If DIMM 108 ₁ receives forwarded write command 205 ₂ (e.g., from forward WR 214 ₁), DIMM 108 ₁ will select the column 234 ₃ of the activated bank and row. If near-memory compute module 120 ₁ intercepts write command 205 ₂, the near-memory compute module 120 ₁ will decode command 215 ₁ to determine (e.g., from a look-up table, etc.) a set of instructions (e.g., to read data, to launch subroutine, etc.) that the near-memory compute module 120 ₁ can execute. After a wait time 206 ₂, host controller 102 will provide write data (Din) 207 ₂ to near-memory compute module 120 ₁. If near-memory compute module 120 ₁ has forwarded bank activate 203 ₂ and write command 205 ₂ directly to DIMM 108 ₁, near-memory compute module 120 ₁ will also forward Din 216 ₁ directly to DIMM 108 ₁. DIMM 108 ₁ will then write data 235 ₂ to the selected memory address to complete the same memory write operation as depicted and described in diagram 2A00 of FIG. 2A.

Here, the provided write data (Din) 207 ₂ is a portion 298 of signals used to initiate a data transformation. If near-memory compute module 120 ₁ has intercepted bank activate 203 ₂ and write command 205 ₂, near-memory compute module 120 ₁ will also read operand 217 ₁ for subsequent transactions or operations by sensing the provided write data (Din) 207 ₂ from host controller 102. Near-memory compute module 120 ₁ will then execute operation 218 ₁ according to the instructions and data determined from the previously received decode command 215 ₁ and read operand 217 ₁, respectively. Operation 218 ₁ is performed to determine results 219 ₁.

After a wait time 208 ₂, host controller 102 can issue a read command (RD) 209 ₂ to near-memory compute module 120 ₁. The combination of signals (e.g., column address, etc.) provided by host controller 102 on system bus 110 during read command 209 ₂ will, in part, cause near-memory compute module 120 ₁ to either forward RD command 220 ₁ from host controller 102 directly to DIMM 108 ₁, or intercept and decode command 215 ₂. Strictly as examples:

-   -   If DIMM 108 ₁ receives forwarded read command 209 ₂ (e.g., from         forward RD 220 ₁), DIMM 108 ₁ will select the column 234 ₄ of         the activated bank and row. Here, forwarded read command 209 ₂         is a portion 299 of signals used to initiate execution of a         memory access operation.     -   If near-memory compute module 120 ₁ intercepts read command 209         ₂, near-memory compute module 120 ₁ will decode command 215 ₂ to         determine (e.g., from a look-up table, etc.) a set of         instructions (e.g., to access memory, to provide data, etc.)         near-memory compute module 120 ₁ will execute.     -   Near-memory compute module 120 ₁ will then get results 221 ₁         according to the instructions and information determined from         previous steps decode command 215 ₂ and determine results 219 ₁.         After a wait time 210 ₂, host controller 102 will expect data to         be provided on system bus 110. If DIMM 108 ₁ receives forwarded         read command 209 ₂ (e.g., from forward RD220 ₁), DIMM 108 ₁ will         provide read data (Dout) 235 ₂ and near-memory compute module         120 ₁ will then forward Dout 222 ₁ to system bus 110 to complete         the memory read operation as depicted and described in diagram         2A00 of FIG. 2A.

If near-memory compute module 120 ₁ has intercepted read command 209 ₂, near-memory compute module 120 ₁ will then provide operation results 223 ₁ to system bus 110. Host controller 102 will then sense the dataset on system bus 110 and read data 211 ₂ for use in subsequent operations and processing at CPU core 103. Near-memory compute module 120 ₁ can use memory chips 109 ₁ on DIMM 108 ₁ to support operations (e.g., steps 212 ₁, 213 ₁, 214 ₁, 215 ₁, 216 ₁, 217 ₁, 218 ₁, 219 ₁, 220 ₁, 215 ₂, 221 ₁, 222 ₁, and 223 ₁). For example, memory chips 109 ₁ on DIMM 108 ₁ can store command look-up tables, software driver payloads, operands, operation results, etc.

In some embodiments and in some environments, wait times 204 ₂, 206 ₂, 208 ₂, and 210 ₂ can be of varying known durations. The wait times accommodate the inherent electrical response time or latency associated with accessing datasets on memory chips 109 ₁. When the durations of wait times 204 ₂, 206 ₂, 208 ₂, and 210 ₂ are known, memory controller 105 of host controller 102 can schedule commands 202 ₂ that account for the required delays between commands and operations. For a JEDEC DDR4 SDRAM standard physical interface 111, for example, wait time 206 ₂ (e.g., write latency or WL) is specified as 9 clock cycles when operating at 1600 MT/s with no additive latency. For the same JEDEC DDR4 SDRAM standard physical interface 111, wait time 210 ₂ (e.g., read latency or RL) is specified as 11 clock cycles when operating at 1600 MT/s with no additive latency.

Diagram 2B00 in comparison to diagram 2A00 further shows the product interoperability of the herein-described near-memory compute module 120 ₁. Specifically, host controller 102 activity (e.g., steps 202 ₂, 203 ₂, 204 ₂, 205 ₂, 206 ₂, 207 ₂, 208 ₂, 209 ₂, 210 ₂, and 211 ₂) in diagram 2B00 with near-memory compute module 120 ₁ has the same characteristics (e.g., sequence, function, etc.) as host controller 102 activity (e.g., steps 202 ₁, 203 ₁, 204 ₁, 205 ₁, 206 ₁, 207 ₁, 208 ₁, 209 ₁, 210 ₁, and 211 ₁, respectively) in diagram 2A00 with no near-memory compute module 120 ₁. Similarly, DIMM 108 ₁ activity (e.g., steps 232 ₂, 2332, 234 ₃, 235 ₂, 234 ₄, 207 ₂, and 235 ₂) in diagram 2B00 with near-memory compute module 120 ₁ has the same characteristics (e.g., sequence, function, etc.) as DIMM 108 ₁ activity (e.g., steps 232 ₁, 233 ₁, 234 ₁, 235 ₁, 234 ₂, and 235 ₁, respectively) in diagram 2A00 with no near-memory compute module 120 ₁. Near-memory compute module 120 ₁ can provide additional capability (e.g., steps 212 ₁, 213 ₁, 214 ₁, 215 ₁, 216 ₁, 217 ₁, 218 ₁, 219 ₁, 220 ₁, 215 ₂, 221 ₁, 222 ₁, and 223 ₁) while maintaining standard DIMM 108 ₁ capability (e.g., memory write and memory read operations in diagram 2A00). Still further, the environment 1B00 and diagram 2B00 in comparison to the environment 1A00 and diagram 2A00, respectively, show near-memory compute module 120 ₁ can provide additional capability without requiring changes to standard physical interface 111 and the related communications protocol. More specifically, for example, wait time 206 ₂ in diagram 2B00 with near-memory compute module 120 ₁ can be the same (e.g., 9 clock cycles) as wait time 206 ₁ in environment 2A00 without near-memory compute module 120 ₁. When near-memory compute module 120 ₁ requires extended wait times for certain transactions and operations, variable latency settings (e.g., additive latency and parity latency in JEDEC DDR4 SDRAM standard) can be deployed as needed. The timing attributes of standard physical interface will be described in more detail in FIG. 3 and the associated disclosure.

FIG. 2C is a diagram 2C00 showing additional example communications among a host controller, a near-memory compute module, and a DIMM, as used in memory systems having a near-memory compute module. As an option, one or more instances of diagram 2C00 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, diagram 2C00 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 2C, diagram 2C00 presents example operations and communications on and among host controller 102, near-memory compute module 120 ₁, and DIMM 108 ₁ from diagram 1B00 of FIG. 1B in some embodiments. Specifically, diagram 2C00 depicts a transaction or data transformation operation that is initiated and executed by near-memory compute module 120 ₁, and for which a transaction ID (e.g., tag) and/or status is provided by near-memory compute module 120 ₁. More specifically, host controller 102 and DIMM 108 ₁ can be designed and configured to enable host controller 102 to schedule memory commands 2023 (e.g., by memory controller 105 based on instructions from CPU core 103) while memory chips 109 ₁ of DIMM 108 ₁ are waiting in an idle state 2323. Host controller 102 can then issue a bank activate command (ACT) 2033 to near-memory compute module 120 ₁. The combination of signals (e.g., chip select, bankgroup select, bank select, row address, etc.) provided by host controller 102 on system bus 110 during bank activate 203 ₂ will, in part, cause near-memory compute module 120 ₁ to initialize module 213 ₂ for subsequent activity (e.g., receiving instructions and data for transactions or operations). After a wait time 2043, host controller 102 can issue a read command (RD) 209 ₃ to near-memory compute module 120 ₁. The combination of signals (e.g., column address, etc.) provided by host controller 102 on system bus 110 during read command 209 ₃ will, in part, cause near-memory compute module 120 ₁ to intercept and decode command 215 ₃. Near-memory compute module 120 ₁ will decode command 215 ₃ to determine (e.g., from a look-up table, etc.) a set of instructions (e.g., to access memory, to provide data, etc.) near-memory compute module 120 ₁ will execute. Near-memory compute module 120 ₁ will then execute operation 218 ₂ according to, in part, the instructions determined from previous step decode command 215 ₃. In one example, the duration of the operation launched in execute operation 218 ₂ can be significantly longer than a wait time 210 ₃ (e.g., read latency or RL of 11 clock cycles) and host controller 102 will expect other information (e.g., transaction ID, transaction tag, transaction status, etc.) rather than operation results from near-memory compute module 120 ₁ after wait time 210 ₃. In this example, near-memory compute module 120 ₁ will then determine transaction ID and/or status 224 ₁ and provide transaction ID and/or status 225 ₁ on system bus 110. After wait time 210 ₃ following issue read command (RD) 209 ₄, host controller 102 will sense the dataset on system bus 110 and read data 211 ₃ for use in subsequent operations and processing at CPU core 103. The near-memory compute module 120 ₁ can use memory chips 109 ₁ on DIMM 108 ₁ to support operations (e.g., steps 213 ₂, 215 ₃, 218 ₂, 224 ₁, and 225 ₁). For example, memory chips 109 ₁ on DIMM 108 ₁ can store command look-up tables, software driver payloads, operation results, transaction IDs, and the like.

FIG. 2D is a diagram 2D00 showing additional example communications among a host controller, a near-memory compute module, and a DIMM, as used in memory systems having a near-memory compute module. As an option, one or more instances of diagram 2D00 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, diagram 2D00 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 2D, diagram 2D00 presents example operations and communications on and among host controller 102, near-memory compute module 120 ₁, and DIMM 108 ₁ from diagram 1B00 of FIG. 1B in some embodiments. Specifically, diagram 2D00 depicts a request for transaction or operation results from a previous transaction or operation initiated and executed by near-memory compute module 120 ₁. More specifically, host controller 102 and DIMM 108 ₁ can be designed and configured to enable host controller 102 to schedule memory commands 2024 (e.g., by memory controller 105 based on instructions from CPU core 103) while memory chips 109 ₁ of DIMM 108 ₁ are waiting in an idle state 2324. Host controller 102 can then issue a bank activate command (ACT) 2034 to near-memory compute module 120 ₁. The combination of signals (e.g., chip select, bankgroup select, bank select, row address, etc.) provided by host controller 102 on system bus 110 during bank activate 2034 will, in part, cause near-memory compute module 120 ₁ to initialize module 213 ₃ for subsequent activity (e.g., receiving instructions and data for transactions or operations). After a wait time 2044, host controller 102 can issue a write command (WR) 2053 to near-memory compute module 120 ₁. The combination of signals (e.g., column address, etc.) provided by host controller 102 on system bus 110 during write command 2053 will, in part, cause near-memory compute module 120 ₁ to intercept and decode command 215 ₄. Near-memory compute module 120 ₁ will decode command 215 ₄ to determine (e.g., from a look-up table, etc.) a set of instructions (e.g., to read data, to launch subroutine, etc.) near-memory compute module 120 ₁ will execute. After a wait time 2064, host controller 102 will provide write data (Din) 207 ₃ to near-memory compute module 120 ₁. In this example, decode command 215 ₄ determined near-memory compute module 120 ₁ should expect a transaction ID to be provided by host controller 102 at step 207 ₃. Near-memory compute module 120 ₁ will then read ID 226 ₁ and get results 221 ₂ according to, in part, the instructions and data determined from previous steps decode command 215 ₄ and read ID 226 ₁, respectively.

After a wait time 2084, host controller 102 can issue a read command (RD) 209 ₄ to near-memory compute module 120 ₁. The combination of signals (e.g., column address, etc.) provided by host controller 102 on system bus 110 during read command 209 ₄ will, in part, cause near-memory compute module 120 ₁ to intercept and decode command 215 ₅. Near-memory compute module 120 ₁ will decode command 215 ₄ to determine (e.g., from a look-up table, etc.) a set of instructions (e.g., to access memory, to provide data, etc.) near-memory compute module 120 ₁ will execute. Near-memory compute module 120 ₁ will then provide operation results 223 ₂ on system bus 110 according to, in part, the instructions determined from previous steps decode command 215 ₅ and get results 221 ₂. After wait time 2104 following issue read command (RD) 209 ₄, host controller 102 will sense the dataset on system bus 110 and read data 211 ₄ for use in subsequent operations and processing at CPU core 103. Though not shown in diagram 2D00, near-memory compute module 120 ₁ can use memory chips 109 ₁ on DIMM 108 ₁ to support operations (e.g., steps 213 ₃, 215 ₄, 226 ₁, 221 ₂, 215 ₅, and 223 ₂). For example, memory chips 109 ₁ on DIMM 108 ₁ can store command look-up tables, software driver payloads, operation results, transaction IDs, and the like.

FIG. 3 presents annotated timing diagrams 300 for memory systems having a near-memory compute module in comparison to memory systems not having a near-memory compute module. As an option, one or more instances of timing diagrams 300 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, timing diagrams 300 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 3, timing diagrams 300 comprises signal timing sequences for a first example 301 and a second example 302. First example 301 represents signal timing sequences for systems having no near-memory compute module, such as shown in environment 1A00 of FIG. 1A. Specifically, example 301 represents signal timing sequences for the memory write operation followed by the memory read operation as shown in diagram 2A00. Second example 302 represents signal timing sequences for systems having one or more near-memory compute modules, such as shown in environment 1B00 of FIG. 1B. Specifically, example 302 represents signal timing sequences for the transaction or data transformation operation utilizing a single operand initiated and executed by near-memory compute module 120 ₁ as shown in diagram 2B00. In both examples 301 and 302, and in reference to environments 1A00 and 1B00, the signals and timing are represented as provided on system bus 110 with standard physical interface 111 based on the JEDEC DDR4 SDRAM standard. Other reference points and physical interface standards can be applied in other examples and embodiments.

More specifically, example 301 comprises a clock signal (CK) 310 ₁, a command signal (CMD) 311 ₁, and a data signal (DQ) 312 ₁. CK 310 ₁ represents a differential clock signal (e.g., CK_t and CK_c) on which the system timing is based. CMD 311 ₁ represents a combination of signals (e.g., RAS_n, CAS_n, WE_n, etc.) that define a command provided to a receiving component in the system (e.g, host controller 102, DIMM 108 ₁, etc.). DQ 312 ₁ represents a bi-directional data bus on which datasets are transferred among components in the system. At time TO, write command (WR) 205 ₁ will be issued on CMD 311 ₁ to initiate the write operation. After wait time 206 ₁, dataset Din 207 ₁ will be available on DQ 312 ₁. As shown, Din 207 ₁ is first available at T9, or 9 clock cycles after WR 205 ₁ (e.g., the WL when operating at 1600 MT/s with no additive latency). After wait time 208 ₁ and at time T15, read command (RD) 209 ₁ will be issued on CMD 311 ₁ to initiate the read operation. After wait time 210 ₁, dataset Dout 235 ₁ will be available on DQ 312 ₁. As shown, Dout 235 ₁ is first available at T26, or 11 clock cycles after RD 209 ₁ (e.g., the RL when operating at 1600 MT/s with no additive latency). Wait time 208 ₁ is represented in example 301 as six clock cycles in duration, but can vary depending on several factors (e.g., dataset length, bank selection, etc.).

Example 302 in comparison to example 301 will show that having near-memory compute module 120 ₁ in the memory system can have no impact on the timing and signaling requirements of standard physical interface 111, providing additional capability without costly changes to the memory system architecture. More specifically, example 302 comprises a clock signal (CK) 310 ₂, a command signal (CMD) 311 ₂, and a data signal (DQ) 312 ₂. CK 310 ₂ represents a differential clock signal (e.g., CK_t and CK_c) on which the system timing is based. CMD 311 ₂ represents a combination of signals (e.g., RAS_n, CAS_n, WE_n, etc.) that define a command provided to a receiving component in the system (e.g, host controller 102, DIMM 108-₁, near-memory compute module 120 ₁, etc.). DQ 312 ₂ represents a bi-directional data bus on which datasets are transferred among components in the system. At time TO, write command (WR) 205 ₂ will be issued on CMD 311 ₂ to initiate the transaction. After wait time 206 ₂, dataset Din 207 ₂ will be available on DQ 312 ₂. In example 302 and diagram 2B00, Din 207 ₂ represents the operand to be used by near-memory compute module 120 ₁ in the transaction. As shown, Din 207 ₂ is first available at T9, or 9 clock cycles after WR 205 ₂ (e.g., the WL when operating at 1600 MT/s with no additive latency). After wait time 208 ₂ and at time T15, read command (RD) 209 ₂ will be issued on CMD 311 ₂ to initiate the read results operation. After wait time 210 ₂, dataset Dout 223 ₁ will be available on DQ 312 ₂. In example 302 and diagram 2B00, Dout 223 ₁ represents the results of the transaction or operation executed by near-memory compute module 120 ₁. As shown, Dout 223 ₁ is first available at T26, or 11 clock cycles after RD 209 ₂ (e.g., the RL when operating at 1600 MT/s with no additive latency). Wait time 208 ₂ is represented in example 302 as six clock cycles in duration, but can vary depending on several factors (e.g., dataset length, bank selection, etc.). Further, example 302 shows a processing 320 of the transaction or operation at near-memory compute module 120 ₁ will occur during the time after Din 207 ₂ (e.g., the operand) is received and before Dout 223 ₁ (e.g., the results) are expected. In other examples and embodiments, processing 320 can begin earlier in the timing sequence (e.g., background processing).

FIG. 4A is a diagram 4A00 depicting varying spatial and temporal locality present in memory systems having near-memory compute module. As an option, one or more instances of diagram 4A00 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, diagram 4A00 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 4A, diagram 4A00 depicts a memory system 420 comprising host controller 102 and DIMM 108 ₁, configured as described in environment 1A00 of FIG. 1A. Diagram 4A00 further comprises a first bar chart 406 representing attributes of memory system 420 when exhibiting high spatial locality and high temporal locality, a second bar chart 408 representing attributes of memory system 420 when exhibiting high spatial locality, and a third bar chart 410 representing attributes of memory system 420 when exhibiting low locality. Bar charts 406, 408, and 410 depict a memory access rate 402 and a cache hit rate 404 for CPU core 103 (CPU), cache memory 104 (Cache), and DIMM 108 ₁ (DRAM).

Architectures such as are shown for memory system 420 that have a separation between CPU core 103 and DIMM 108 ₁ and use multiple levels or hierarchies (e.g., L1, L2, and L3) of cache memory 104 are effective for computing applications with runtime datasets that fit within the capacity of cache memory 104. These applications have a high degree of temporal and spatial locality for dataset accesses as represented in bar chart 406. High temporal and spatial locality results in high cache hit rates 404 and increases the responsiveness of such computing applications. In other computing applications that have only high spatial locality (e.g., video streaming) as represented in bar chart 408, various techniques (e.g., cache prefetching algorithms) can be deployed to mitigate the impact of relative (e.g., compared to cache memory 104) access latency of DIMM 108 ₁. In computing applications with low spatial and temporal locality (e.g., random querying or key-value indexing of large datasets) as represented in bar chart 410, dataset access will bypass cache memory 104 and primarily require data movement to and from DIMM 108 ₁ for data transformation operations. Legacy memory systems used in such applications require more power to be expended in data movement than in data transformation operations. Legacy memory systems will also tie up the host controller during these data movement and transformation operations, further limiting the performance of the computing system.

FIG. 4B is a diagram 4B00 showing performance improvements when using a near-memory compute module. As an option, one or more instances of diagram 4B00 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, diagram 4B00 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 4B, diagram 4B00 depicts a first memory system 421 comprising host controller 102 and DIMM 108 ₁, configured as described in environment 1A00 of FIG. 1A. Diagram 4B00 further depicts a second memory system 422 comprising host controller 102 and CDIMM 122 ₁, configured as described in environment 1B00 of FIG. 1B. CDIMM 122 ₁ further comprises near-memory compute module 120 ₁. In both memory systems 421 and 422, CPU core 103 can complete an operation requiring DIMM access 430 ₁ and 4302, respectively, in a time T_(DO) (e.g., 100 ns). In computing applications with low spatial and temporal locality, memory system 421 will need to access DIMM 430 ₁ a large number of times (e.g., M=1000) to complete a given set of operations or instructions at CPU core 103. In contrast, memory system 422 with near-memory compute module 120 ₁ will need a much smaller number (e.g., N=100) of DIMM operations 4302 to complete the same set of operations or instructions at CPU core 103. The reduction in DIMM operations for memory system 422 is enabled, in part, by the ability of near-memory compute module 120 ₁ to initiate background processing 423 of transactions and operations local to DIMM 108 ₁ of CDIMM 122 ₁. Specifically, background processing 423 can execute operations requiring DIMM access in a much shorter time T_(BP) (e.g., 25 ns) relative to time T_(DO), and can execute operations in parallel (e.g., P=8 operations in parallel) to yield an effective operation execution time of T_(BP)÷P (e.g., 3.125 ns). Further, with data transformation operations or computing in close proximity to memory chips 109 ₁ and 109 ₂, less power will be expended in data movement. Additional background computing capability within CDIMMs 122 ₁ and 122 ₂ will also allow some tasks to be offloaded from host controller 102 so it can attend to other compute bound operations. The parallel, background, and near-memory computing capability provided by near-memory compute module 120 ₁, can offer significant computing and memory system performance speed-ups.

FIG. 5 depicts an environment 500 showing components of a near-memory compute module. As an option, one or more instances of environment 500 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, environment 500 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 5, environment 500 comprises host controller 102, system bus 110, and standard physical interface 111 of environment 1B00 of FIG. 1B. Environment 500 further comprises a CDIMM 502 coupled to host controller 102 through system bus 110 and standard physical interface 111 (e.g., compliant with the JEDEC DDR4 SDRAM standard, Serial ATA SerDes standard, etc.). Still further, CDIMM 502 comprises a near-memory compute module 510 coupled to a first set of DRAM devices 519 ₁, a second set of DRAM devices 5192, and a flash memory device 520 (e.g., comprising a single flash memory device or multiple flash memory devices). Near-memory compute module 510 further comprises a transaction processor 530, a set of processor cores 514, a set of off-load engines 515, a first memory controller 516, a second memory controller 517, and a flash controller 518, wherein transaction processor 530 includes a set of data buffers 511, a data plane memory (e.g., within data plane module 512), and a control plane memory (e.g., within control plane module 513). In some embodiments, CDIMM 502 can comprise one device (e.g., system-on-chip or SoC), multiple devices in a single package or printed circuit board, multiple separate devices, and can have other variations, modifications, and alternatives. In one embodiment, CDIMM 502 can be implemented in a first integrated circuit package having a periphery 505 i. In another embodiment, near-memory compute module 510 can be implemented in a second integrated circuit package having a periphery 505 ₂.

CDIMM 502 drives and receives signals to and from system bus 110, respectively, at data buffers 511. Data buffers 511 can provide buffering to boost the drive of the signals (e.g., DQ, CA, RA, etc.) on system bus 110 to help mitigate high electrical loads of large computing and memory systems. Various implementations of data buffers 511 can allow CDIMM 502 to be configured to emulate or appear as a UDIMM, RDIMM, LRDIMM, or other type of DIMM to host controller 102, increasing the interoperability of CDIMM 502 with other DIMMs.

Data plane 512 and control plane 513 together decode and route information for CDIMM 502. In some embodiments, data plane 512 and control plane 513 can be implemented in SRAM and appear as regular system physical memory to host controller 102. Data plane 512 stores the payload of a software driver that decodes commands and initiates transactions or data transformation operations using information provided on system bus 110 and by control plane 513. IMDB applications other applications can control operations of the CDIMM 502 by sending commands to the control plane 513, which the CDIMM 502 accepts and uses to operate on data stored in the data plane 512. Some transactions or data transformation operations from data plane 512 using commands from control plane 513 are launched on processor cores 514 and off-load engines 515. For example, processor cores 514 can execute a data transformation operation for dataset objects stored in the plurality of DRAM devices 519. Processor cores 514 can also interface with off-load engines 515 inside CDIMM 502 to accelerate data transformation operations (e.g., compress, uncompress, encrypt, decrypt, Galois field arithmetic, hash index calculations, etc.).

Memory controllers 516 and 517 interface with DRAM devices 519 ₁ and DRAM devices 5192, respectively. In some embodiments, at least one memory controller (e.g., memory controller 516) can communicate with at least one set of DRAM devices (e.g., DRAM devices 519 ₁) using standard physical interface 111. The plurality of DRAM devices 519 can be various types (e.g., DRR4, DDR3, LPDDR3, etc.) as these devices are decoupled from host controller 102 and managed only by memory controllers 516 and 517 of CDIMM 502. Memory controllers 516 and 517 also have advanced error checking and correction (ECC) configurations to support high reliability error correction and repair for the plurality of DRAM devices 519. This is possible since the plurality of DRAM devices 519 on CDIMM 502 are not directly accessible by host controller 102. The configuration of the plurality of DRAM devices 519 ₁ is reported upon boot-up by the BIOS to the kernel software through the ACPI data structures. Flash controller 518 interfaces with flash memory device 520 on CDIMM 502. In some embodiments, flash memory device 520 can be NAND flash devices, but flash memory device 520 can also represent other non-volatile memory types (e.g., PCM, ReRAM). Processor cores 514 can also provide firmware support for flash controller 518.

In one example, CDIMM 502 can be deployed for in-memory database (IMDB or in-memory compute) applications. IMDB is a database management system that primarily relies on main memory (e.g., the plurality of DRAM devices 519) for computer data storage. IMDB systems are faster than disk storage databases since the internal optimization algorithms are simpler and execute fewer CPU instructions. Accessing data in main memory is significantly faster than accessing data in disk storage, providing for higher performance (e.g., speed and predictability) of the memory system and IMDB application. CDIMM 502 can further improve performance in IMDB applications through near-memory and parallel computing capabilities. IMDB systems have increased in popularity, especially in the data analytics space, since the mid-2000s due to decreasing DRAM costs. Applications with critical response requirements (e.g., telecommunications network equipment, mobile advertising networks, etc.) and applications with non-structured or flexible database schemas (e.g., NoSQL database MongoDB, etc.) can deploy IMDB and CDIMM 502 to improve responsiveness and performance.

FIG. 6 depicts an environment 600 including a transactional memory controller implemented as a near-memory compute module. As an option, one or more instances of environment 600 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, environment 600 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 6, environment 600 comprises a transactional memory controller (TMC) device 610, a host controller 620, a first set of DRAM devices 640 ₁ (e.g., DDR4 SDRAM devices), a second set of DRAM devices 640 ₂ (e.g., DDR4 SDRAM devices), a solid-state drive (SSD) controller 670, and a flash memory 660 (e.g., comprising a single flash memory device, multiple flash memory devices, or other non-volatile memory devices). Host controller 620 further comprises a CPU core 621, a serializer module 622, and a deserializer module 623. TMC 610 further comprises a deserializer module 612, a serializer module 613, a control module 614, a built-in self-test (BIST) module 615, a Joint Test Action Group (JTAG) IEEE 1149.1 standard test access port and boundary-scan architecture module 616, a switch module 617, an SSD port controller 670, a first DRAM memory controller 619 ₁, and a second DRAM memory controller 619 ₂. In certain uses herein, the term “transactional” relates to in-order or out-of-order instructions and/or commands or transactions having variable latency responses.

TMC 610 is coupled to host controller 620 through high speed serializer/deserializer (SerDes) links 130. Environment 600 shows TMC 610 coupled to a single host controller 620, but TMC 610 can be coupled to multiple host controllers in other embodiments. TMC 610 is further coupled to the plurality of DRAM devices 640 through standard physical interface 111 (e.g., JEDEC DDR4 SDRAM standard), wherein standard physical interface 111 can be a variety of interfaces selected according to the type of main memory technology (e.g., DRR4, DDR3, LPDDR3, etc.) implemented in environment 600. Environment 600 shows two DRAM memory controllers 619 ₁ and 619 ₂ coupled to the plurality of DRAM devices 640, but TMC 610 can support a plurality of memory controllers of various types coupled to a plurality of memory devices of various types in other embodiments. Environment 600 also shows flash memory 660 (e.g., NAND flash memory) coupled to TMC 610 through SSD controller 670, which functions as an intermediary controller for flash memory 660. Environment 600 shows TMC 610 comprising a single SSD port controller 618 coupled to a single SSD controller 670 and flash memory 660, but TMC 610 can support multiple SSD port controllers, multiple SSD controllers, and multiple flash memory devices in other embodiments. In some embodiments, TMC 610 can be coupled to other types of storage devices (e.g., SRAM storage, resistive storage, disk storage, etc.) and other types of functional devices (e.g., processors). In some embodiments, TMC 610 and surrounding components (e.g., 640 ₁, 640 ₂, 660, and 670) can comprise one device (e.g., system-on-chip or SoC), multiple devices in a single package or printed circuit board, multiple separate devices, and can have other variations, modifications, and alternatives.

TMC 610 receives from host controller 620 through SerDes link 630 command transactions in the form of packets. Deserializer module 612 receives the packets and can deskew, deserialize, and decode the content of the packet to determine the transaction type and the target of the transaction. Deserializer module 612 transmits the de-serialized and decoded transaction in the form of a command to switch module 617. Using additional routing information from control module 614 (e.g., configured by host controller 620), switch module 617 then routes or forwards the transaction to the appropriate target for the transaction, depending on the command type and the address of the transaction. For example, switch module 617 can route the transaction to one or more of DRAM memory controller 619 ₁, DRAM memory controller 619 ₂, or SSD port controller 618. Switch module further serves to route or forward return information (e.g., transaction results) to serializer 613 to packetize and serialize for transmission to host controller 620 through SerDes link 630. For example, if the transaction request is a read request, switch module 617 will route the transaction to the targeted DRAM memory controller or SSD port controller which will perform the read request and return the requested read data through switch module 617 back to the requestor (e.g., host controller 620) through serializer 613. BIST module 615 and JTAG module 616 further enable implementation and manufacturing of TMC 610 and associated higher level integrations (e.g., CDIMM, motherboard, etc.) by providing test and debug support.

FIG. 7 depicts a diagram 700 showing communications between a host controller and a transactional memory controller implemented as a near-memory compute module. As an option, one or more instances of diagram 700 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, diagram 700 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 7, diagram 700 presents example operations and communications on and among host controller 620 and TCM 610 from environment 600 of FIG. 6 in some embodiments. Specifically, diagram 600 represents the operation of a transaction (e.g., request for data access) sent by host controller 620 to TCM 610 from which a result is returned. To illustrate this example operation, diagram 600 shows a first set of representative modules 720 comprising serializer 622 and deserializer 623 from host controller 620, and a second set of representative modules 710 comprising deserializer 612, serializer 613, switch 617, and DRAM memory controller 619 ₁ from TCM 610. The steps shown in diagram 700 can be modified, combined, or altered (e.g., steps added or removed) in other example and embodiments.

Modules 710 and 720, along with other associated computing and memory system components, can be designed and configured to enable serializer 622 to receive a request 732 (e.g., from CPU core 621 of host controller 620). Serializer 622 will build and serialize a packet 733 from request 732. Step build and serialize packet 733 can include sourcing a transaction tag for the transaction, constructing the packet with an appropriate command type, and generating cyclic redundancy check (CRC) bits, among other operations. The CRC bits provide protection of the integrity of the packet during the transmission of the packet. The transaction tag uniquely identifies a transaction for various purposes (e.g., when TMC 610 returns transaction results out of order). In some embodiments, the packet can be configured to contain atomic operations (e.g., test-and-set, etc.), enabling semaphore operations in a shared memory configuration with multiple host controllers. Step build and serialize packet 733 also includes serializing the packet data to allow serializer 622 to then send packet 734 (e.g., through SerDes link 630) to deserializer 612.

Deserializer 612 will then deserialize and decode packet 735. Step deserializer and decode packet 735 can include receiving the packet, de-skewing the packet, deserializing the packet, decoding the packet (e.g., for command, transaction, and routing information), and performing a CRC check of the packet, among other operations. Deserializer 612 will then send transaction 736 to switch 617 for routing or forwarding. Based on information included in send transaction 736 and other information (e.g., routing or forwarding information from control module 614), switch 617 will then forward transaction 737 to DRAM memory controller 619 ₁. DRAM memory controller 619 ₁ will then generate command 738, which can include performing a clock domain crossing, decoding the transaction, and generating a command sequence, among other operations. DRAM memory controller 619 ₁ will then schedule command 739 to access memory 740 (e.g., DRAM devices 640 ₁). DRAM memory controller 619 ₁ will then return data 741 from access memory 740 operation to switch 617 for return routing or forwarding. Step return data 741 can include checking for errors, correcting errors, and performing a clock domain crossing, among other operations. Switch 617 will then forward data 742 to serializer 613 to build and serialize packet 743. Step build and serialize packet 743 can include attaching the transaction tag associated with the data, constructing the packet in an appropriate format, and generating CRC bits, among other operations. Step build and serialize packet 743 also includes serializing the packet data to allow serializer 613 to then return packet 744 (e.g., through SerDes link 630) to deserializer 623. Deserializer 623 will then deserialize and decode packet 745. Step deserializer and decode packet 745 can include receiving the packet, de-skewing the packet, deserializing the packet, decoding the packet (e.g., for command, transaction, and routing information), and performing a CRC check of the packet, among other operations. Deserializer 623 will then return data 746 (e.g., to CPU core 621 of host controller 620).

FIG. 8 is a block diagram 800 of a switch module used in a transactional memory controller implemented as a near-memory compute module. As an option, one or more instances of block diagram 800 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, block diagram 800 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 8, block diagram 800 comprises a switch module 802. In some embodiments, switch module 802 can replace switch module 617 in TMC 610 of environment 600 in FIG. 6. Switch 802 comprises a number of interface ports 810, 820, 830, 840, 850 and 860. Each interface port 810, 820, 830, 840, 850, and 860 further comprises a payload input port, a routing control port, a payload output port, and a payload output status port. For example, interface port 810 includes payload input port 811, routing control port 812, payload output port 813, and payload output status port 814. Similarly, interface port 820 includes payload input port 821, routing control port 822, payload output port 823, and payload output status port 824. Switch module 802 serves to deliver payload from one payload input port to another payload output port as selected by the routing control port. Additionally, data payloads routed through switch module 802 can also include one or more transaction IDs that can be used for further processing (e.g., completion of the transaction sequence). For example, a data payload with transaction ID FOO is provided on payload input port 811 and routing information is provided on routing control port 812 such that payload output port 823 is selected to receive the data payload. Switch module 802 then routes the data payload to payload output port 823 and provides a status of the data payload on payload output status port 824. The object that had received the data payload with transaction ID FOO on output port 823 may return status or data from the payload input port 821 and provide the routing information on routing control port 822 to return the data or status to interface port 810 with the same transaction ID FOO.

FIG. 9 is a functional layer diagram 900 of a deserializer module used in a transactional memory controller implemented as a near-memory compute module. As an option, one or more instances of diagram 900 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, the diagram 900 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 9, functional layer diagram 900 comprises a deserializer module 902. In some embodiments, deserializer 902 can replace deserializer 612 in TMC 610 of environment 600 in FIG. 6. Deserializer 902 comprises a TMC PHY layer 910, a transactional packet generation layer 920, and a transaction layer 930. TMC PHY layer 910 provides the physical interface for signals presented by components external to a TMC (e.g., signals from host controller 620 on SerDes link 630). Transactional packet generation layer 920 performs various operations (e.g., CRC checking, error handling, NAK processing, tag sourcing, destination routing construction, etc.) and builds the data payload for processing by transaction layer 930.

FIG. 10 is a functional layer diagram 1000 of a serializer module used in a transactional memory controller implemented as a near-memory compute module. As an option, one or more instances of diagram 1000 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, diagram 1000 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 10, functional layer diagram 1000 comprises a serializer module 1002. In some embodiments, serializer 1002 can replace serializer 613 in TMC 610 of environment 600 in FIG. 6. Serializer 1002 comprises a TMC PHY layer 1010, a transactional packet integrity layer 1020, and a transaction layer 1030. TMC PHY layer 1010 provides the physical interface for signals delivered to components external to a TMC (e.g., signals to host controller 620 on SerDes link 630). Transactional packet integrity layer 1020 performs various operations (e.g., CRC generation, tag sourcing, destination routing construction, etc.) of the data payload.

FIG. 11 is a block diagram 1100 of a DRAM memory controller used in a transactional memory controller implemented as a near-memory compute module. As an option, one or more instances of block diagram 1100 or any aspect thereof may be implemented in the context of the architecture and functionality of the embodiments described herein. Also, block diagram 1100 or any aspect thereof may be implemented in any desired environment.

As shown in FIG. 11, block diagram 1100 comprises a DRAM memory controller 1102. In some embodiments, DRAM memory controller 1102 can replace DRAM memory controllers 619 ₁ and/or 619 ₂ in TMC 610 of environment 600 in FIG. 6. DRAM memory controller 1102 further comprises a DRAM PHY module 1110, a DRAM initialization and training module 1111, a DRAM power management module 1112, a transaction queue module 1113, a DRAM address mapping and command translation module 1114, a refresh scheduling module 1115, a DRAM scheduling module 1116, a write FIFO 1117, a read FIFO 1118, an error checking and correction (ECC) module 1119, an error handling module 1120, a DRAM repair component 1121, and a near-memory compute module 1122.

DRAM PHY module 1110 interfaces with DRAM devices and is also closely coupled to a DRAM initialization and training module 1111 and a DRAM power management module 1112. DRAM power management module 1112 can be configured to autonomously manage the state (e.g., power state) of the coupled DRAM devices based on the transactions received at controller 1102 or sensed at any point in the memory system (e.g., deserializer 612 of TMC 610). Transaction queue module 1113 receives and manages transactions sent to DRAM memory controller 1102. DRAM address mapping and command translation module 1114 maps and decodes the transactions into DRAM commands. Refresh scheduling module 1115 generates DRAM refresh commands and DRAM scheduling module 1116 queues and schedules DRAM commands as needed. Write FIFO 1117 sends data through DRAM PHY module 1110 to the DRAM devices, and read FIFO 1118 receives data through DRAM PHY module 1110 from the DRAM devices. Error checking and correction module 1119 checks received data for errors (e.g., single error correction or multi-error correction). If errors are discovered, error handling module 1120 logs and handles the errors. If DRAM repair is needed (e.g., based on error history recorded by module 1120), DRAM repair component 1121 can repair faulty DRAM cells, blocks or devices.

Additional Embodiments

Various additional embodiments are disclosed below. Aspects of the embodiments can be combined. For example, embodiment 1 can include aspects of embodiment 2 and aspects of embodiment 3.

Embodiment 1

A transactional memory interface integrated circuit device comprising:

-   -   a deserializer module coupled to the switch module and         configured to receive the packet in a serial format and to         process the packet to convert the serial format into a parallel         format, the packet comprising at least command information;     -   a switch module configured to communicate to a host CPU using at         least the packet including a tag and payload, and configured to         route the packet to one of a plurality of devices or modules;     -   a control module coupled to the switch module, and the         deserializer module, and configured to process communications         between the plurality of devices or modules, without interacting         with the host CPU; and     -   a memory controller configured to the switch module, the memory         controller being configured to process the packet to be         compatible with a selected memory device.

Embodiment 2

The device of embodiment 1 wherein one of the plurality of devices is selected from a DRAM device, a Flash device, an SRAM storage module, a resistive memory device, a storage device, or a processing module.

Embodiment 3

The device of embodiment 1 wherein the deserializer module comprises a PHY layer, a packet integrity module, and a transactional layer.

Embodiment 4

The device of embodiment 1 wherein the memory controller is a DRAM memory controller, a Flash Memory controller, or other memory controller.

Embodiment 5

The device of embodiment 1 wherein the memory controller comprises a plurality of memory controller, each of which is configured to communicate with a plurality of DRAM devices.

Embodiment 6

The device of embodiment 1 wherein the memory controller comprises a plurality of memory controller, each of which is configured to communicate with a plurality of memory devices.

Embodiment 7

The device of embodiment 1 wherein the memory controller comprises a plurality of DRAM memory controllers, each of which is configured to communicate with a plurality of DRAM devices, and a plurality of Flash memory controllers, each of which is configured to communicate with a plurality of Flash memory devices.

Embodiment 8

The device of embodiment 1 wherein the host CPU is coupled to a serializer module, the serializer module being configured to create a packet with command information and process the packet from a parallel format to the serial format to be transferred via a high speed communication channel to the deserializer module.

Embodiment 9

The device of embodiment 1 further comprising a system board configured for placement of the integrated circuit device.

Embodiment 10

The device of embodiment 1 wherein the memory controllers are configured to autonomously manage each power state of the coupled memory devices depending on an access pattern of a plurality of packets received by the deserializer module.

Embodiment 11

The device of embodiment 10 wherein each of the memory devices are in standby states and is ready for an immediate access.

Embodiment 12

The device of embodiment 10 wherein each of the memory devices is in a power-down state until at least one of the plurality of packets is received by the deserializer module.

Embodiment 13

The device of embodiment 10 wherein each of the memory devices is in a power down state until at least one of the plurality of packets is received by the deserializer module and thereafter a selected set of memory devices is in a stand-by state based upon at least one of the plurality of packets.

Embodiment 14

The device of embodiment 1 wherein the memory controller is configured to provide a single or multi-error detection and correction process.

Embodiment 15

The device of embodiment 14 wherein the single or multiple error detection and correction process is configured to store an error condition to accumulate a history of a plurality of error occurrences and based on the history of at least one or more error occurrences, configured to initiate a memory repair process.

Embodiment 16

The device of embodiment 1 wherein the host CPU is configured to process one or more packets to configure the control module.

Embodiment 17

The device of embodiment 1 wherein the host CPU is configured to process one or more packets to configure the control module and effect processing of data.

Embodiment 18

The device of embodiment 1 further comprising an additional host CPU or a plurality of other host CPUs coupled to the device.

Embodiment 19

The device of embodiment 18 wherein the packet is configured to contain a conditional atomic operation selected from at least one of a Test-and-Set, an enabling semaphore operations in a shared memory configuration with multiple hosts.

In the foregoing specification, the disclosure has been described with reference to specific embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the disclosure.

Finally, it should be noted that there are alternative ways of implementing the embodiments disclosed herein. Accordingly, the present embodiments are to be considered as illustrative and not restrictive, and the claims are not to be limited to the details given herein, but may be modified within the scope and equivalents thereof. 

1. (canceled)
 2. A transactional memory interface device comprising: a transaction processor coupled to a first physical interface to send and receive first signals to and from a host controller, the transaction processor comprising a data buffer to buffer the first signals; and a memory controller coupled to the transaction processor and to a second physical interface to send and receive second signals to and from a plurality of dynamic random access memory (DRAM) devices, wherein the transaction processor is to: decode a command in a first portion of the first signals; initiate, in response to the command, a set of data transformation operations on a dataset stored in at least one DRAM device of the plurality of DRAM devices based on data received from the host controller; send results of the set of data transformation operations to the host controller via the first physical interface, wherein the set of data transformation operations are performed locally by the memory controller and the transaction processor without further interaction with the host controller; decode an access operation in a second portion of the first signals, wherein the access operation is a standard write access operation or a standard read access operation; and forward the access operation to the memory controller, the memory controller to initiate execution of the access operation with the plurality of DRAM devices via the second physical interface.
 3. The transactional memory interface device of claim 2, further comprising an off-load engine coupled to the transaction processor, wherein the off-load engine is to accelerate the set of data transformation operations by performing one or more data transformation operations.
 4. The transactional memory interface of claim 3, wherein the one or more data transformation operations are at least a compress operation, a uncompress operation, an encryption operation, a decryption operation, a Galois field arithmetic operation, a hashing operation, or an indexing operation.
 5. The transactional memory interface device of claim 2, further comprising an off-load engine coupled to the transaction processor, wherein the transaction processor and the off-load engine perform the set data transformation operations as parallel background processing.
 6. The transactional memory interface device of claim 2, wherein the first physical interface is a standard memory interface.
 7. The transactional memory interface device of claim 2, wherein the first physical interface is a JEDEC DDR4 DRAM standard interface.
 8. The transactional memory interface device of claim 2, wherein the transaction processor comprises a set of data buffers to send and receive the first signals to and from the host controller and send and receive the second signals to and from the plurality of DRAM devices, wherein the set of data buffers allow the plurality of DRAM devices to emulate a type of Dual In-Line Memory Module (DIMM) selected from an un-buffered DIMM type (UDIMM), a load-reduction DIMM type (LRDIMM), and a registered DIMM type (RDIMM).
 9. The transactional memory interface device of claim 2, wherein the transaction processor is to communicate with the host controller using the first physical interface so as to appear as a physical memory to the host controller.
 10. The transactional memory interface device of claim 2, further comprising an integrated circuit package periphery, wherein the transaction processor and the memory controller reside in the integrated circuit package periphery.
 11. The transactional memory interface device of claim 10, wherein the transaction processor comprises: data plane memory; control plane memory; and data buffers coupled to the first physical interface.
 12. The transactional memory interface device of claim 11, further comprising: a plurality of processor cores; a plurality of off-load engines; a second memory controller; and a non-volatile memory controller, wherein the plurality of processor cores, the plurality of off-load engines, the second memory controller, and the non-volatile memory controller reside in the integrated circuit package periphery.
 13. The transactional memory interface device of claim 2, further comprising an integrated circuit package periphery, wherein the transaction processor, the memory controller, and the plurality of DRAM devices reside in the integrated circuit package periphery.
 14. The transactional memory interface device of claim 13, wherein the transaction processor comprises: data plane memory; control plane memory; and data buffers coupled to the first physical interface.
 15. The transactional memory interface device of claim 14, further comprising: a plurality of processor cores; a plurality of off-load engines; a second memory controller; a non-volatile memory controller, and a non-volatile memory device coupled to the non-volatile memory controller, wherein the plurality of processor cores, the plurality of off-load engines, the second memory controller, the non-volatile memory controller, and the non-volatile memory device reside in the integrated circuit package periphery.
 16. The transactional memory interface device of claim 2, wherein the transaction processor is further to: store the first signals in the data buffer to intercept the first portion of the first signals; determine, based on the command, a set of one or more instructions to perform the set of data transformation operations; execute the set of instructions during one or more wait times after the first portion is intercepted and before the results from the set of data transformation operations are expected by the host controller; and determine the results from execution of the set of instructions.
 17. The transactional memory interface device of claim 16, wherein the transaction processor is further to: store the first signals in the data buffer to intercept a second portion of the first signals, wherein the access operation is decoded in the second portion of the first signals; forward the second portion of the first signals to the memory controller to initiate execution of the access operation as the standard write access operation or the standard read access operation; and when the second portion corresponds to the standard write access operation, receive write data associated with the write access operation from the host controller and forward the write data to the memory controller; and when the second portion corresponds to the standard read access operation, receive read data associated with the read access operation from the memory controller and forward, to the host controller, the read data during one or more wait times after the first portion of the first signals is intercepted and before the results of the set of data transformation operations are expected by the host controller.
 18. The transactional memory interface device of claim 2, wherein the second physical interface is a standard memory interface.
 19. The transactional memory interface device of claim 2, wherein the second physical interface is a JEDEC DDR4 DRAM standard interface.
 20. A compute dual in-line memory module comprising: a plurality of dynamic random access memory (DRAM) devices; a transaction processor coupled to a first physical interface to send and receive first signals to and from a host controller, the transaction processor comprising a data buffer to buffer the first signals; and a memory controller coupled to the transaction processor and to a second physical interface to send and receive second signals to and from the plurality of DRAM devices, wherein the transaction processor is to: decode a command in a first portion of the first signals; initiate, in response to the command, a set of data transformation operations on a dataset stored in at least one DRAM device of the plurality of DRAM devices based on data received from the host controller; send results of the set of data transformation operations to the host controller via the first physical interface, wherein the set of data transformation operations are performed locally by the memory controller and the transaction processor without further interaction with the host controller; decode an access operation in a second portion of the first signals, wherein the access operation is a standard write access operation or a standard read access operation; and forward the access operation to the memory controller, the memory controller to initiate execution of the access operation with the plurality of DRAM devices via the second physical interface.
 21. A transactional memory interface device comprising: a first physical interface to receive a combination of signals from a host controller; a second physical interface to send or receive data to or from a plurality of dynamic random access memory (DRAM) devices; a transaction processor coupled to the first physical interface; and a memory controller coupled to the transaction processor and the second physical interface, the memory controller to execute standard memory access operation on at least one of the plurality of DRAM devices, wherein the transaction processor is to: decode a command in a first portion of the combination of signals; execute a set of instructions to perform a data transformation during one or more wait times in response to the command; determine operation results from the set of instructions; decode a second portion of the combination of signals as corresponding to a standard write access operation or a standard read access operation; forward the second portion of the combination of signals to the memory controller to initiate execution of the standard write access operation or the standard read access operation; and when the second portion corresponds to the write access operation, receive write data associated with the write access operation from the host controller and forward the write data to the memory controller; and when the second portion corresponds to the read access operation, receive read data associated with the read access operation from the memory controller and forward, to the host controller, the read data during one or more wait times after the first portion of the combination of signals is decoded and before operation results from the data transformation are expected by the host controller. 